Die Schwerpunkte der Konferenz sind folgende:
- Developments of measurement methods and instrumentation
- Material processing and residual stresses
- Influence of residual stresses on physical and mechanical properties of materials and components
- Measurement and assessment of residual microstresses and intergranular stresses
- Residual strains and stresses in complex materials, e.g. multiphase materials and biomaterials
- Residual stresses in thin films and microcomponents
- Industrial applications of residual stress analysis using synchrotron radiation, neutrons, and X-rays
- Complementary methods for materials analysis with photons and neutrons: Imaging, Texture, etc.
